2015 EPEPS Conference
October 25-28, 2015
EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society.
The IBIS Open Forum is pleased to announce their IBIS Summit meeting at EPEPS 2015. The Summit will be held during the afternoon of Wednesday, October 28, 2015. The titles or topics can be found in the program.
IBIS Summits are designed to enable face-to-face interactions between model users, model makers and tool developers in the IBIS community.
The reservation deadline to receive the EPEPS rate of $199 per night has been
extended until October 15, 2015.
Register now and save.