EPEPS 2017: San Jose, California
IEEE

2017 EPEPS Conference
October 15-18, 2017

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is sponsored by the IEEE Electronics Packaging Society.

Workshop on Machine Learning for Hardware Design

This workshop immediately follows EPEPS; no charge for attendees. The event is sponsored by the Center for Advanced Electronics through Machine Learning (CAEML). click here for more information.

Conference Early Bird Registration is available until September 30, 2017