EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society.
Conference registration and hotel registration will open late July.
Check this page regularly for updates!
Important dates to remember
- Early bird registration end Sept. 30, 2015
- Hotel reservations close Sept. 25, 2015 (5pm Pacific Time)
- Paper submission deadline is
June 26, 2015extended to July 17, 2015
Early Bird Registration will open August 1, 2015.