EPEPS 2018: San Jose, California
IEEE
EPEPS
The Design and Analysis Frontier of Electronics Packaging

Sponsorships/Exhibits

For information on how to become a sponsor please check the Sponsorship Packages or contact Emma Marshall, emarshal@illinois.edu

Gold Sponsors/Exhibitors

Cadence

Cadence PCB technologies provide unique, cost-effective, and scalable capabilities for designing electronics products. With OrCAD® products, you get an affordable, yet sophisticated, PCB technology at your desktop. Allegro® solutions enable a constraint-driven design flow from concept to manufacturing. Sigrity™ technology offers the only proven path for system-level, power-aware signal integrity/ SSN compliance. Visit us at the show or the www.cadence.com website for help designing today’s complex PCBs and IC packaging.

Silver Sponsors/Exhibitors

Keysight Technologies

On Sept. 19, 2013, Agilent Technologies announced plans to separate into two publicly traded companies through a tax-free spinoff of its electronic measurement business. The new company, Keysight Technologies, began operating as a wholly owned subsidiary of Agilent on Aug. 1, 2014 with a full separation anticipated in early November 2014. Keysight is expected to trade on the NYSE under the symbol KEYS.

Keysight is a global electronic measurement technology and market leader helping to transform its customers’ measurement experience through innovation in wireless, modular, and software solutions. Keysight provides electronic measurement instruments and systems and related software, software design tools and services used in the design, development, manufacture, installation, deployment and operation of electronic equipment. Information about Keysight is available at www.keysight.com 

Rambus

Rambus is one of the world's premier technology licensing companies. Founded in 1990, the Company specializes in the invention and design of architectures focused on enriching the end-user experience of electronic systems. Rambus' patented innovations and breakthrough technologies help industry-leading companies bring superior products to market. Rambus licenses both its world-class patent portfolio, as well as its family of leadership and industry-standard solutions. Rambus has offices in California, North Carolina, Ohio, India, Germany, Japan, Korea, and Taiwan. Additional information is available at www.rambus.com.

CST

CST - Computer Simulation Technology develops and markets high performance software for the simulation of electromagnetic fields in all frequency bands. CST's success is based on the implementation of unique, leading edge technology in a user-friendly interface.

IBM Research

IBM Research is pushing the boundaries of science, technology and business to make the world work better. Our global network of scientists work on a range of applied and exploratory research projects to help clients, governments and universities apply scientific breakthroughs to solve real-world business and societal challenges.

Mentor Graphics

Mentor, A Siemens Business is the worldwide market leader in PCB systems design, advanced IC Packaging solutions and analysis technologies. Mentor, A Siemens Business will be showcasing Xpedition Package Integrator with HyperLynx, a holistic solution for IC/Package/Board cross-domain planning, assembly, optimization and electrical analysis . Visit our Booth to learn more about Mentor’s technologies and best practices for IC/Package/Board co-design or by attending Mentor’s technical presentations.

ANSYS develops, markets and supports engineering simulation software used to predict how product designs will behave and how manufacturing processes will operate in real-world environments. The company continually advances simulation solutions by, first, developing or acquiring the very best technology; then integrating it into a unified and customizable simulation platform that allows engineers to efficiently perform complex simulations involving the interaction of multiple physics; and, finally, providing system services to manage simulation processes and data — all so engineers and product developers can spend more time designing and improving products and less time using software and searching for data.

Intel

You may know us for our processors. But we do so much more. Through computing innovation, we push the boundaries of smart and connected technology to make amazing experiences possible for every person on Earth. From powering the latest devices and the cloud you depend on, to driving policy, diversity, sustainability, and education, we create value for our stockholders, customers, and society.

Qualcomm

That’s how often people around the world touch something made better by Qualcomm. It could be the smartphone in your pocket, the tablet on your coffee table, that wireless modem in your briefcase… it could even be that navigation system in your car or that action camera strapped to your chest. Who is Qualcomm, and what do we do? We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—invent mobile technology breakthroughs. While many of our inventions and breakthroughs reside “under the hood” of consumer electronics, they have transformed the world in a big way. They have helped propel mobile to the forefront of the technology world and to the top of consumers’ wish lists. They have created new opportunities for mobile ecosystem players—the wireless device makers, the operators, the developers and the content creators of the world. And more recently, our inventions and breakthroughs have inspired fresh, new ideas from those companies—large and small—new to the wireless space. We’ve been called dreamers, inventors, rebels, risk takers, pioneers and geeks. We embrace those labels because in many ways, they’re true. We dream big. We invent bigger. And most importantly, we often do what many thought was impossible.

Xpeedic

Xpeedic provides innovative technology solution to enable our customers to achieve fast time-to-market. Our EDA software offers fast and accurate EM simulation solution for IC-package-system designs. Our IP solution on silicon integrated passive devices (IPD) together with the System-in-Package (SiP) technology achieves both miniaturization and high performance for RF and mixed signal designs.