EPEPS 2021: Virtual Event
IEEE

Sponsorships/Exhibits

Coming Soon!

For information on how to become a sponsor please check the Sponsorship Packages or contact epeps-admin@emlab.illinois.edu

Platinum Sponsors/Exhibitors

Gold Sponsors/Exhibitors

Intel

You may know us for our processors. But we do so much more. Through computing innovation, we push the boundaries of smart and connected technology to make amazing experiences possible for every person on Earth. From powering the latest devices and the cloud you depend on, to driving policy, diversity, sustainability, and education, we create value for our stockholders, customers, and society.

Silver Sponsors/Exhibitors

Xpeedic

Xpeedic provides innovative technology solution to enable our customers to achieve fast time-to-market. Our EDA software offers fast and accurate EM simulation solution for IC-package-system designs. Our IP solution on silicon integrated passive devices (IPD) together with the System-in-Package (SiP) technology achieves both miniaturization and high performance for RF and mixed signal designs.

Amphenol

Amphenol is one of the largest manufacturers of interconnect products in the world. The company designs, manufactures, and markets electrical, electronic, and fiber-optic connectors, coaxial and flat-ribbon cable, and interconnect systems. The company has a worldwide vision of “Enabling the Electronic Revolution.”

Cadence

Cadence PCB technologies provide unique, cost-effective, and scalable capabilities for designing electronics products. With OrCAD® products, you get an affordable, yet sophisticated, PCB technology at your desktop. Allegro® solutions enable a constraint-driven design flow from concept to manufacturing. Sigrity™ technology offers the only proven path for system-level, power-aware signal integrity/ SSN compliance. Visit us at the show or the www.cadence.com website for help designing today’s complex PCBs and IC packaging.

Exhibitors