EPEPS 2019: Montreal, Canada

Call for Papers

For a PDF version of the call for papers, please click here.

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis, synthesis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and CAD/design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society. Authors are invited to submit papers describing new technical contributions related to the broad area of electrical performance of high-performance interconnect systems, covering:

  1. Emerging and advanced issues,
  2. New design techniques and innovative architectures
  3. Novel CAD concepts, methodologies and algorithms for modeling, simulation and optimization,

with emphasis on:

  • System-level, board-level, package-level and on-chip interconnects
  • High-speed channels, links, backplanes, serial and parallel interconnects, SerDes
  • RF/microwave/mm-wave packaging structures and components, antenna-in-package and RFIC co-design, mixed signal modules and wireless switches
  • Signal and thermal integrity
  • Power integrity and power distribution networks
  • Low power mobile and personal applications
  • Memory and DDR interfaces
  • Jitter and noise management
  • Electronic packages and microsystems
  • Heterogeneous integration, 2.5D/3D interconnects and packages, TSVs and MCMs
  • Electromagnetic (EM) and EM interference modeling, simulation algorithms, tools, and flows
  • Macromodeling and model order reduction as it applies to electrical analysis
  • Advanced and parallel CAD techniques for signal, power, and thermal integrity analysis
  • Measurement and data analysis techniques for system‐level and on‐chip structures.

Submission Deadline: July 15, 2019

Submission Format: 2 column, 3 page, PDF format only.

Submitted manuscripts should be camera ready and compliant with the general standards of the IEEE, including appropriate referencing. Noncompliant manuscripts will not be considered for review.

Tutorials/Workshops: EPEPS offers tutorials on state-of-the-art topics during the conference.

Exhibits: EPEPS offers an excellent array of exhibits. EPEPS is an exciting forum for vendors to demonstrate their state-of-the-art-tools to the attendees. Interested vendors can contact the conference administration for more details.

Conference Co-chairs: