EPEPS 2023: Milpitas CA

Call for Papers

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, measurement, analysis, synthesis, and design of electronic interconnections, packages, and systems. It also focuses on new methodologies and CAD/design techniques for evaluating signal, power, and thermal integrity and ensuring performance in high‐speed, RF, and wireless designs. EPEPS is jointly sponsored by IEEE Electronics Packaging Society, IEEE Microwave Theory and Technology Society and IEEE Antennas and Propagation Society. Submitted papers should describe new technical contributions related to the area of electrical performance of high‐performance interconnect systems, covering:

  • Novel interconnect designs and technologies (including optical and wireless)
  • Unconventional interconnect technologies: transparent, wearable, bendable, environmentally-friendly, made in MEMS- and nano-technology
  • High-frequency interconnects and packages for RF, microwave, mmWave applications; antennas-in-package
  • High-speed channels, backplanes, SerDes, memory and DDR interfaces
  • Signal and power integrity
  • Jitter and noise
  • Interconnect and transceiver co-design, equalization
  • Low-power interconnects and transceivers
  • 2.5D/3D integration: interconnection and packaging aspects
  • Advanced packaging
  • Design and co-design of interconnects and packages
  • Quantum systems: interconnection and packaging aspects
  • Measurement techniques, challenges
  • Manufacturing, testing, reliability, repairability
  • Modeling, simulation, computer-aided design (including macro-modeling, model order reduction, optimization, uncertainty, yield)
  • Electromagnetic modeling and simulation
  • Machine learning and AI-based approaches
  • Thermal, mechanical, multiphysics modeling

Submission Deadline: July 17, 2023 July 31, 2023

Submission Format: 2 column, 3 page, PDF format only. Selected papers will be invited for a special issue in IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Submitted manuscripts should be camera ready and compliant with the general standards of the IEEE, including appropriate referencing. Noncompliant manuscripts will not be considered for review.

Location: EPEPS 2023 will be held in Milpitas, CA, USA.

Tutorials: EPEPS offers tutorials on state-of-the-art topics including latest advances: on CAD software tool techniques for package/PCB design, SI and PI modeling, high-speed SerDes simulation, high precision measurement techniques and novel interconnect design.

IEEE Education Credits: IEEE offers professional development hours (PDHs) and continuing education units (CEUs) for attending the EPEPS program.

Simulation Benchmarking: EPEPS 2023 organizers invite paper submissions covering simulation tool development advances which utilize benchmarks established and released publicly by the IEEE TC-EDMS Packaging Benchmarks Committee (http://www.packaging-benchmarks.org/).

Exhibits: EPEPS offers an excellent array of exhibits. EPEPS is an exciting forum for vendors to demonstrate their state-of-the-art-tools to the attendees. Interested vendors can contact the conference administration for more details.

Conference Co-chairs: