Jose Schutt-Aine, UIUC
Bill Chen, ASE Group
Kemal Aygun, Intel
3:20 - 5:00
Session M-III: Poster Session
Chairs:
Jose Hejase, Nvidia
Vladimir Ohkmatovski, University of Manitoba
M-III.1. Advanced Measurement and Simulation Approach for DDR5 On-chip SI/PI with the Probing Package (22)
WonSuk Choi, SangKeun Kwak, Jaeseok Park, Jiyoung Do, Byeongseon Yun, Yoo-jeong Kwon, Dongyeop Kim, Kyudong Lee, Tae young Kim, Wonyoung Kim, Kyoungsun Kim, Sung Joo Park, Jeonghyeon Cho
Samsung Electronics
M-III.2. Codimensional Optimization of Differential Via Padstacks (75)
Jiwoong Jeon1, Shivani Joshi1, Daniel de Araujo1, Bhyrav Mutnury2
1Siemens EDA
2Dell EMC
M-III.3. Distributed PDN Modeling Approach for Accurate Jitter Estimation in High-Speed NAND Flash Memory (3)
1Korea Advanced Institute of Science and Technology
2SK Hynix
10:00 - 10:20
Coffee Break
10:20 - 12:00
Session T-II: Applied Electromagnetics
Chairs:
Piero Triverio, University of Toronto
T-II.1. Interconnect Modeling using a Surface Admittance Operator Derived with the Fokas Method (32) (Student Competition)
Dries Bosman1, Martijn Huynen1, Daniel De Zutter1, Xiao Sun2, Nicolas Pantano2, Geert Van der Plas2, Eric Beyne2, Dries Vande Ginste1
1Ghent University
2imec
T-II.2. CISPR 25 Radiated Emission Simulation and Measurement Correlation of an Automotive Reinforced Isolated Switch Driver (42)
Jie Chen1, Rajen Murugan1, Sooping Saw1, Francisco Lauzurique1, John Broze1, Craig Greenberg1, Alex Triano1, Bibhu Nayak2, Harikiran Muniganti2, Joe Sivaswamy2, Dipanjan Gope2
1Korea Advanced Institute of Science and Technology
2SK Hynix
T-II.4. An Efficient Methodology to Parse and Mesh Large Interconnect Layouts for Electromagnetic Analysis (72) (Student Competition) (Benchmark Competition)
T-II.5. Novel Closed-Form 2-D Green's Function of Shielded Layered Media And Its Use in Transmission Lines Inductance Extractin (69)
Shucheng Zheng, Vladimir Okhmatovski
University of Manitoba
12:00 - 1:20
Lunch Break
12:00 - 1:30
TPC Meeting
1:30 - 3:00
Packaging Benchmark Workshop - Part 1
Chairs:
Vladimir Ohkmatovski, University of Manitoba
Heidi Barnes, Keysight
3:00 - 3:20
Coffee Break
3:20 - 5:00
Packaging Benchmark Workshop - Part 2
Chairs:
Vladimir Ohkmatovski, University of Manitoba
Heidi Barnes, Keysight
5:00 - 5:50
Sponsors Student Recruiting Event
7:00 - 9:00
Banquet
7:00 - 7:50
Breakfast
7:50 - 8:00
Day 4 Welcome
8:00 - 9:00
Keynote III
Chair:
Zhen Peng, University of Illinois Urbana-Champaign
Packaging and module integration as a catalyst for innovation in millimeter-wave systems
Alberto Valdes-Garcia
IBM Research
9:00 - 9:40
Session W-I: Advanced CAD
Chairs:
Paolo Manfredi, Politecnico di Torino
W-I.1. An Efficient Parallel Electromagnetic Solver for Extracting Scattering Parameters from Large Electrical Interconnects With Many Ports (70) (Student Competition) (Benchmark Competition)
Damian Marek, Piero Triverio
University of Toronto
W-I.2. A Transfer Learning Approach to Expedite Training of Artificial Neural Networks for Variability-Aware Signal Integrity Analysis of MWCNT Interconnects (62)