EPEPS 2017: San Jose, California
IEEE

Gold Sponsors

Cadence

Silver Sponsors

Keysight Technologies

Rambus

Conference Sponsors

Society Sponsors

IEEE Components, Packaging & Manufacturing Technology Society

The IEEE Microwave Theory and Techniques Society

CONFERENCE Committees

Conference Co-chairs:

Paul Franzon, paulf@ncsu.edu
Xiaoxion (Kevin) Gu, xgu@us.ibm.com

Technical Program Committee (TPC):

  • Peter H. Aaen, University of Surrey, UK
  • Ramachandra Achar, Carleton University
  • Kemal Aygun, Intel
  • Heidi Barnes, Keysight
  • Dale Becker, IBM
  • Wendem Beyene, Rambus
  • Henning Braunisch, Intel
  • Swagato Chakraborty, Mentor Graphics
  • Paul Franzon, North Carolina State University
  • Dipanjan Gope, Indian Institute of Science
  • Stefano Grivet-Talocia, Politecnico di Torino
  • Xiaoxion (Kevin) Gu, IBM
  • Lijun Jiang, University of Hong Kong
  • Roni Khazaka, McGill University
  • Joungho Kim, KAIST
  • Albert Ruehli, Emeritus IBM; MST
  • Jose Schutt-Aine, University of Illinois
  • Andreas Weisshaar, Oregon State University
  • Thomas-Michael Winkel, IBM
  • Tzong-Lin Wu, National Taiwan University
  • Tingdong Zhou, Freescale
  • Yaping Zhou, Nvidia

Paper Review Committee (PRC):

  • Giulio Antonini, University of L'Aquila
  • Hideki Asai, Shizuoka University
  • CK Cheng, University of California at San Diego
  • Daniel DeAraujo, Mentor Graphics
  • Dirk Deschrijver, Ghent University
  • Tom Dhaene, Ghent University
  • Matt Doyle, IBM
  • Ege Engin, San Diego State University
  • Francesco Ferranti, Vrije Universiteit Brussel
  • Emad Gad, University of Ottawa
  • Stefano Grivet-Talocia, Politecnico di Torino
  • Kijin Han, KAIST
  • Anand Haridass, IBM
  • Jose Hejase, IBM
  • Shaowu Huang,Invensas
  • Dong Kam, Ajou University
  • Jingook Kim, UNIST
  • Subramanian Lalgudi, ANSYS
  • Naiguang Lei,Mentor Graphics
  • Erping Li, Zhejiang University
  • Antonio Maffucci, University of Cassino and Southern Lazio
  • Ivan Maio, Politecnico di Torino
  • Paolo Manfredi, Ghent University
  • Mosin Mondal, Mentor Graphics
  • Zhen Mu, Cadence
  • Rajen Murugan, Texas Instruments
  • Bhyrav Mutnury, Dell
  • Ivan Ndip, Fraunhofer IZM
  • Behzad Nouri, Carleton University
  • Vladimir Okhmatovsky, University of Manitoba
  • Antonio Orlandi, University of L'Aquila
  • Sung Joo Park, Georgia Institute of Technology
  • Sourajeet Roy, Colorado State University
  • Sameer Shekhar,Intel
  • Eakhwan Song, Kwangwoon University
  • Jairam Sukumar, Qualcomm
  • Piero Triverio, University of Toronto
  • Dries Vande Ginste, Ghent University
  • Tao Wang,Qualcomm
  • Boping Wu,Huawei
  • Biancun Xie, Intel
  • Xiaoning Ye, Intel
  • Zhen Zhou,Intel