EPEPS 2019: Montreal, Canada
IEEE
Tutorial I
IEEE Draft P370 Electrical Characterization of High-Frequency Interconnects

Heidi Barnes, Keysight Technologies

Key to accurate characterization of high frequency interconnects is the ability to remove the degradation caused by the measurement fixture. IEEE is sponsoring the P370 standard which targets 3 key steps that are needed in achieving accurate electrical characterization of an interconnect at high frequencies for a given application. First is the design of the fixture with specific Fixture Electrical Requirements to reduce errors in the fixture removal calibration and de-embedding. Next is the verification and consistency checks of the fixture removal method or algorithm to understand the accuracy limits for a given application. The final third step is to test the quality of the Interconnect S-parameters after implementing the fixture removal algorithm to verify the quality for use both time and frequency domain simulations. This new IEEE standard is in draft review and expected to be released in 2020. Early adoption by industry accepted SERDES standards is already in consideration. This tutorial will step through an example of measuring the classic series resonant Beatty structure DUT to demonstrate the 3-step process. The results measured to 50GHz will high light the value that this new standard brings to the electrical interconnect community.

Heidi Barnes is a Senior Application Engineer and Power Integrity Product Owner for High Speed Digital applications in the Design Engineering Software Group of Keysight Technologies. Her recent activities include the application of electromagnetic, transient, and channel simulators to solve signal and power integrity challenges. Author of over 20 papers on SI and PI, active member in developing the new IEEE P370 Standard involving interconnect S-parameter quality after fixture removal, and recipient of the DesignCon 2017 Engineer of the Year.

Prior experience includes 7 years in signal integrity for ATE test fixtures for Verigy, an Advantest Group, 8 years in RF/Microwave microcircuit packaging for Agilent Technologies,10 years with NASA in the aerospace industry, and 1 year with Arco Solar in the solar cell industry. She has been with Keysight EDA software since 2012.

Heidi graduated from the California Institute of Technology in 1986 with a bachelor’s degree in electrical engineering.