EPEPS 2018: San Jose, California
Tutorial III
Electro-Thermal-Mechanical Analysis of Packages and Boards

J. Eric Bracken, Chief Technologist, Electronics Business Unit, ANSYS Inc.

There is a relentless trend to pack more capabilities and computing power into ever-smaller electronic devices. IC packages and printed circuit boards are undergoing many changes to support these new levels of miniaturization. A wide variety of three-dimensional, ultra-dense packaging options have been introduced along with a number of different chip-to-chip interconnect technologies. An engineer designing these very complex packages and boards is faced with many questions about their electrical, thermal, and mechanical performance, as well as their long-term reliability. In this tutorial, we will look at how some of these problems can be addressed with physics-based simulation.