EPEPS 2018: San Jose, California
IEEE
Tutorial V
Electrical and Thermal Co-Design for High Power FPGA Packages

Hong Shi, Senior Director of Package Development, Xilinx

This topic describes a systematic approach to design FPGA package for high power applications. As the power consumption up to multi-hundred watts, not only the heat dissipation becomes a challenge, the temperature induced reliability concerns also mount up in the high current and noise-sensitive packages. Two most profound phenomena are substrate electro-migration (EM) and package decoupling capacitor time-dependent-dielectric-breakdown (TDDB). The impact of EM is on maximum current carrying capability and impact of TDDB is on voltage noise suppression capability. However, we find both traditional static way of EM calculation and the legacy design considerations are over-simplified and insufficient for high power products. In this paper, we report an enhanced methodology to derive substrate EM failure rate from composite current and temperature distributions. Moreover, we incorporate capacitor TDDB into the design flow to optimize capacitor lifetime for effective voltage noise suppression. In the end, we apply the electrical and thermal co-design to a 16nm, 200A, high power FPGA meeting all current and dynamic noise specifications