EPEPS 2026: Fort Worth, TX
IEEE

Call for Papers

For a PDF version of the call for papers, please click here.

EPEPS is the premier international conference on advanced and emerging issues in the electrical modeling, analysis, and design of electronic interconnections, packages, and systems. Over four days, the conference will feature the latest advancements in modeling, design, and measurement techniques for SI, PI, and performance optimization in highspeed, RF, wireless and quantum systems.

We are happy to announce that select papers from this year's EPEPS will be invited to submit a full-length special section paper to IEEE Transactions on Components, Packaging and Manufacturing Technology. High-quality papers on SI/PI topics may also be invited for a possible extension in the EMC Magazine SI/PI column.

Interconnects design & technologies

  • High-speed channels, backplanes,SerDes, memory, DDR interfaces
  • Interconnect and transceiver codesign, equalization
  • Signal & power integrity issues
  • Jitter, noise
  • High-frequency interconnects,packages, antennas-in-package
  • Novel/unconventional interconnect technologies

Manufacturing and measurement

  • Manufacturing, testing, reliability
  • Measurement techniques

Packaging and integration

  • Advanced packaging, 3D integration
  • Heterogeneous integration
  • Design of interconnects and packages
  • Quantum systems: interconnection & packaging aspects

Modeling and simulation

  • Modeling, simulation, computer-aided design
  • Thermal, mechanical, multiphysics modeling
  • ML and AI-based approaches to interconnect and packaging problems

Submission Deadline: June 29, 2026 July 13, 2026 July 22, 2026

Submission Format: 2 column, 3 page, PDF format only. Selected papers will be invited for a special issue in IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Submitted manuscripts should be camera ready and compliant with the general standards of the IEEE, including appropriate referencing. Noncompliant manuscripts will not be considered for review.

Location: EPEPS 2026 will be held in Fort Worth, TX, USA.

Tutorials: EPEPS offers tutorials on state-of-the-art topics including latest advances: on CAD software tool techniques for package/PCB design, SI and PI modeling, high-speed SerDes simulation, high precision measurement techniques and novel interconnect design.

IEEE Education Credits: IEEE offers professional development hours (PDHs) and continuing education units (CEUs) for attending the EPEPS program.

Simulation Benchmarking: EPEPS 2026 organizers invite paper submissions covering simulation tool development advances which utilize benchmarks established and released publicly by the IEEE TC-EDMS Packaging Benchmarks Committee (http://www.packaging-benchmarks.org/).

Exhibits: EPEPS offers an excellent array of exhibits. EPEPS is an exciting forum for vendors to demonstrate their state-of-the-art-tools to the attendees. Interested vendors can contact the conference administration for more details.

Conference Co-chairs: