Jihong Ren, META
Augmented Reality Applications and Power Electronics Challenges Keynote 2
Olena Zhu, Intel Corporation
Empowering Engineers, Enabling Innovation: The AI Journey Special Session
Dan Lambalot, Alphawave Semi
Ken Willis, Cadence Design Systems
Chris Cheng, Hewlett-Packard Enterprise
Sandeep Kumar Goel, TSMC
Co-Design Roadmap for Heterogeneous Integration Tutorial 1
Inna Partin-Vaisband, University of Illinois Chicago
Vertical Power Delivery for High-Density Computing: Challenges and Opportunities Tutorial 2
Masum Hossain, Carleton University
Digital equalization for Multilevel signaling in high-speed SerDes Tutorial 3
Vladimir Okhmatovski, University of Manitoba
Tensor Train Acceleration of Volume Integral Equation Solutions for EM Analysis of Interconnects Tutorial 4
Rohit Sharma, IIT Ropar
High-speed Interconnect Design for next-gen AI Hardware Tutorial 5
Patrick Zabinski, Mayo Clinic
Signal integrity Engineering With Superconductors: An Introduction Tutorial 6
Soumitra Joy, University of North Carolina at Charlotte
Electrical and Thermal Integrity in Interconnect Design: challenges and new opportunities